SMD-Serie
Reed-Relais in Oberflächenmontage
1. Product Features
- Surface mount package for automatic pick-and-place assembly
- J-lead or Gull-wing terminal designs
- High-speed switching and low contact resistance
- Fully sealed packaging for reflow process reliability
- Optional magnetic shielding and diode options
2. Performance Data
| Parameter | Unit | Wert |
|---|---|---|
| Contact Rating (Max) | W | 10 |
| Switching Voltage (Max DC) | V | 200 |
| Switching Current (Max DC) | A | 0.5 |
| Carry Current (Max) | A | 1.0 |
| Insulation Resistance (Min) | Ω | 10¹⁰ |
| Dielectric Strength (Open Contacts) | VDC | 250 |
| Betriebstemperatur | °C | -40 ~ +85 |
3. Coil Parameters
| Rated Voltage (VDC) | Pull-in Voltage (VDC) | Drop-out Voltage (VDC) | Coil Resistance (±10%Ω at 20°C) |
|---|---|---|---|
| 5 | 3.75 | 0.5 | 150 - 500 |
| 12 | 9.0 | 1.0 | 500 - 1000 |
4. Outline Drawing & Dimensions
SMD footprint with J-lead or Gull-wing lead frames. Refer to specific packaging drawings for reflow solder pad designs.
5. Precautions for Use
- Reflow Profile: Reflow soldering should follow JEDEC standards, maximum peak temperature 260°C.
- Washing: Ensure wash process does not damage the seal of the relay.
- Environment: Keep distance from strong external magnetic fields to prevent contact behavior issues.